Micron Unveils Compact UFS 4.0 Package at MWC 2024
At the Mobile World Congress 2024, Micron, the renowned American memory chip manufacturer, introduced its latest innovation, setting a new benchmark in compact storage solutions. The company revealed its most diminutive UFS 4.0 package to date, measuring a mere 9 x 13 millimeters, while still boasting an impressive capacity of up to 1 TB and stellar performance metrics: 4300 MB/s sequential read and 4000 MB/s sequential write speeds.
The development of this smaller form factor was primarily driven by feedback from smartphone OEMs, who expressed a growing demand for increased space to accommodate larger batteries. Leveraging insights gathered from its collaborative customer labs spanning the United States, China, and Korea, Micron meticulously engineered this product, leveraging its cutting-edge 232-layer 3D NAND technology.
Compared to its predecessor, launched just last June with dimensions of 11 x 13 mm, the footprint of the UFS 4.0 chip has been significantly reduced by 20%. This reduction not only contributes to a more streamlined design but also facilitates decreased power consumption without any compromise in overall performance.
Micron has introduced a proprietary feature called High-Performance Mode (HPM), designed to optimize performance during intensive smartphone usage. With HPM enabled, users can experience a notable 25% improvement in speed, ensuring seamless operation even under demanding conditions.
With the release of the new UFS 4.0 storage samples in three capacities (256 GB, 512 GB, and 1 TB), Micron has achieved yet another significant milestone in its dedication to providing state-of-the-art storage solutions that are specifically designed to satisfy the changing demands of the mobile sector.