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MediaTek Unveils Dimensity 8300 Chipset with Cutting-Edge Armv9 CPU, Enhanced GPU, and Generative AI

mediatek dimensity 8300 001

The Dimensity 8300 is the most recent 8000-series chipset from MediaTek. The new SoC, based on TSMC's second-generation 4nm technology, is a straight replacement for the Dimensity 8200 from the previous year and offers improvements in all performance areas.

The Arm Cortex-A715 performance cores with a maximum clock speed of 3.35GHz and the Arm Cortex-A510 efficiency units with a maximum clock speed of 2.2GHz are featured in the Dimensity 8300. MediaTek promises 20% higher CPU performance and 30% peak power efficiency benefits over the previous Dimensity 8200. All eight cores are based on the Armv9 CPU architecture.

Dimensity 8300
Dimensity 8200
Dimensity 8100
Node
4 nm
4 nm
5 nm
CPU Prime
1x Cortex-A715 @ 3.35 GHz
1x Cortex-A78 @ 3.1 GHz
-
CPU Big
3x Cortex-A715 @ 3.0 GHz
4x Cortex-A78 @ 3.0 GHz
4x Cortex-A78 @ 2.85 GHz
CPU Little
4x Cortex-A510 @ 2.2 GHz
4x Cortex-A55 @ 2.0 GHz
4x Cortex-A55 @ 2.0 GHz
RAM
LPDDR5X (up to 8,533Mbps)
LPDDR5 (up to 6,400 Mbps)
LPDDR5 (up to 6,400 Mbps)
Storage
UFS 4.0 with MCQ
UFS 3.1
UFS 3.1
GPU
Mali-G615 (60% faster than 8200)
Mali-G610 MC6
Mali-G610 MC6
Display
FHD+ @ 180Hz, WQHD+ @ 120Hz
FHD+ @ 168 Hz, WQHD+ @ 120 Hz
FHD+ @ 180Hz, WQHD+ @ 120Hz
Camera (stills)
320 MP
320 MP
200 MP
Camera (video)
4K @ 60 fps (HDR10+)
4K @ 60 fps (HDR10+)
4K @ 60 fps (HDR10+)
5G
5.17 Gbps downlink
4.7 Gbps downlink
4.7 Gbps downlink
Wi-Fi
Wi-Fi 6E (2x2)
Wi-Fi 6E (2x2)
Wi-Fi 6E (2x2)
Bluetooth
5.4
5.3
5.3

The Arm Mali-G615 MC6 GPU, which increases performance by up to 60% and power efficiency by up to 55% at peak speeds compared to the previous model, is another feature of the new chip. With the new processor, MediaTek promises up to 17% quicker cold start times for apps and up to 47% faster standby app launches. Along with UFS 4.0 storage that supports Multi-Circular Queue (MCQ) and quad-channel LPDDR5X RAM at 8,533Mbps, the new processor also offers these features.

dimensity 8300 features

The Dimensity 8300 is the first chip in its class to handle LLM with up to 10 billion parameters and Generative AI with steady diffusion thanks to its APU 780. Up to 320MP camera sensors and 4K video recording at 60 frames per second are supported with the Imagiq 980 ISP.

An integrated 5G modem that supports dual-mode 5G and up to 5.17Gbps downlink on sub-6GHz networks is a feature of the Dimensity 8300. Additionally, the chip has Bluetooth 5.4 and Wi-Fi 6E connection.

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