MediaTek Launches Flagship Dimensity 9300+ Chipset With Support For On-Device AI

mediatek dimensity 9300 new
Photo Credit: MediaTek

The MediaTek Dimensity 9300+ chipset was recently unveiled by the company on Tuesday. According to MediaTek, the AI-enabled chipset will support on-device multimodal application processing. The chipset’s All-Big-Core CPU architecture is a standout feature, with a Cortex-X4 core that can reach speeds of up to 3.4GHz, alongside three additional Cortex-X4 cores and four Cortex-A720 cores. This configuration ensures that the chipset can handle intensive tasks with ease.

In terms of memory and storage, the Dimensity 9300+ is equipped to support the latest standards, including LPDDR5T memory and UFS 4.0 storage, which translates to quicker app loading times and smoother multitasking. The 3rd generation TSMC 4nm manufacturing process used to build the chipset is a testament to its cutting-edge nature, promising both power efficiency and high performance.

Artificial intelligence is another area where the Dimensity 9300+ shines, thanks to its APU 790 generative AI engine and NeuroPilot Speculative Decode Acceleration technology. These features enable the chipset to perform AI-related tasks more efficiently, enhancing user experiences across various applications.

For gamers, the chipset’s 12-core GPU and Mobile Raytracing capabilities mean that they can enjoy high-fidelity graphics and fluid gameplay. MediaTek’s HyperEngine technology further enhances the gaming experience by optimizing network connectivity and power usage.

The chipset also excels in media capabilities with its Imagiq 990 ISP, which supports 18-bit RAW image capture and advanced videography features. The MiraVision 990 technology ensures that users get a cinematic viewing experience with sharp displays and support for the latest HDR standards.

MediaTek Dimensity 9300+ Specifications and Features

CPU Configuration
1x Cortex-X4 up to 3.4GHz, 3x Cortex-X4 up to 2.85GHz, 4x Cortex-A720 up to 2.0GHz
Memory Support
LPDDR5T 9600Mbps
Storage Support
UFS 4.0 + MCQ
Manufacturing Process
3rd generation TSMC 4nm
AI Engine
APU 790 generative AI engine
AI Technology
NeuroPilot Speculative Decode Acceleration, ExecuTorch Delegation support
Flagship 12-core GPU
Gaming Technology
Mobile Raytracing, MediaTek Adaptive Gaming Technology
Network Optimization
MediaTek HyperEngine with Network Observation System (NOS)
Imaging ISP
Imagiq 990 ISP with 18-bit RAW support
Display Enhancement
MiraVision 990 with AI-Display enhancements
Thermal Design
2nd generation thermal optimized package design
Generative AI Capabilities
Support for on-device LoRA Fusion and various AI collaborations
Media Capture
AI Semantic Analysis Video Engine, high dynamic range audio recording
Power Efficiency
Improved power savings in gaming and network prediction


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